Difference between revisions of "Integrated passive devices"

Latest revision as of 13:49, 10 December 2011

This article provides insufficient context for those unfamiliar with the subject. Please help improve the article with a good introductory style. (February 2009)

Integrated Passive Devices (IPDs) are attracting an increasing interest due to constant needs of handheld wireless devices to further decrease in size and cost and increase in functionality.

Many functional blocks such as impedance matching circuits, harmonic filters, couplers and baluns and power combiner/divider can be realized by IPDs technology. IPDs are generally fabricated using standard wafer fab technologies such as thin film and photolithography processing. IPDs can be designed as flip chip mountable or wire bodable components and the substates for IPDs usually are thin film substrates like silicon, alumina or glass.

References

• Lianjun Liu et al., Compact Harmonic Filter Design and Fabrication Using IPD Technology, IEEE Transactions on components and packaging technologies, Vol 30, No. 4, 2007
• YongTaek Lee, Kai Liu et al., High Rejection Low-Pass-Filter Design Using Integrated Passive Device Technology for Chip-Scale Module Package, Electronic Components and Technology Conference (ECTC), 2010
• Kai Liu, YongTaek Lee et al., Die Thickness Effects in RF IPD Front-end Module Stack-Die Assemblies, Electronic Components and Technology Conference (ECTC), 2010