Flying probe
From Self-sufficiency
It has been suggested that this article or section be merged into In-circuit test. (Discuss) Proposed since November 2009. |
Flying probe test systems are often used for only testing basic production, prototypes, and boards that present accessibility problems. Flying probe testing uses electro-mechanically controlled probes to access components on printed circuit assemblies (PCAs). Commonly used for test of analog components, analog signature analysis, and short/open circuits. They can be classified as in-circuit test (ICT) systems or as Manufacturing Defects Analyzers (MDAs). They provide an alternative to the bed-of-nails technique for contacting the components on printed circuit boards. The precision movement can probe points on PLCCs, SOICs, PGAs, SSOPs, QFPs and others, without any expensive fixturing or programming required.
Uses
- 4-wire Kelvin measurements
- Analog component testing
- Analog signature analysis
- ATE diagnostics
- Boundary scan testing
- Open/short detection
- Power-off testing
Benefits
- Lower cost than Bed Of Nails, because no fixturing required
- Fast time to first test, because of fast development cycle
