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• Hitachi
  ...ounded in 1910 by [[Namihei Odaira]] as an electrical equipment repair and manufacturing facility. This facility was named Hitachi, and is regarded as the ancestral * [[Semiconductor manufacturing equipment]]
  12 KB (1,537 words) - 21:55, 20 September 2010
• Emerson Electric Company
  predecessor = Emerson Electric Manufacturing Co. | Emerson was established in 1890 as ''Emerson Electric Manufacturing Co.'' by Civil War Union veteran [[John Wesley Emerson]] to manufacture [[e
  12 KB (1,532 words) - 21:55, 20 September 2010
• Cooper Tools
  | industry = Manufacturing ...ooper Tools''' is a division of [[Cooper Industries]], a [[Houston]]-based manufacturing company. It is composed of '''Cooper Hand Tools''' and '''Cooper Power Tool
  4 KB (510 words) - 21:55, 20 September 2010
• Techtronic Industries
  | industry = [[Electrical]] and [[electronic products]] [[manufacturing]] ...|TTNDY}}), '''Techtronic''' or '''TTI''', is one of the world's leading [[manufacturing]] and [[trading]] company in [[electrical]] and [[electronic products]]. It
  2 KB (244 words) - 21:55, 20 September 2010
• Ryobi
  industry = Manufacturing| ...ufacturer of [[Electronic component|components]] for the [[automobile]], [[electronics]], and [[telecommunications]] industries. They also create [[printing]] eq
  2 KB (249 words) - 21:55, 20 September 2010
• Deere & Company
  ...l as various locations in the Midwest and southeastern United States. Most manufacturing sites are in Iowa or Illinois, as well as locations in Europe. Carl Westby ...//www.phoeintl.com Phoenix International Corporation] (ruggedized Off-Road electronics) [[Fargo, ND]].
  11 KB (1,472 words) - 21:55, 20 September 2010
• Panasonic Corporation
  | industry = [[Consumer electronics]] ...aka Prefecture|Osaka]], [[Japan]]. Its main business is in [[electronics]] manufacturing and it produces products under a variety of names including Panasonic and [
  21 KB (2,873 words) - 21:55, 20 September 2010
• Robert Bosch GmbH
  ...lectronic stability control|Electronic Stability Program]] (ESP®), [[body electronics]] (such as central locking, doors, windows and seats), and oxygen [[sensor] ...breaking ceremony for a 28.000 m² lithium-ion battery cell manufacturing plant in September 2009 and it is scheduled to start production for hybrid
  20 KB (2,762 words) - 21:55, 20 September 2010
• List of companies named after people
  * [[Colt's Manufacturing Company]], [[Colt Defense]], [[Colt Canada]] – [[Samuel Colt]] * [[Dunlop Manufacturing]] – [[Dunlop Manufacturing|Jim Dunlop]]
  43 KB (4,797 words) - 21:06, 21 September 2010
• Ring oscillator
  ...ructures. They are used during [[wafer testing]] to measure the effects of manufacturing process variations.<ref>
  6 KB (983 words) - 18:24, 9 December 2011
• Counter
  {{About|the term counter used in electronics and computing}} ...emented quite easily using register-type circuits such as the [[Flip-flop (electronics)|flip-flop]], and a wide variety of classifications exist:
  11 KB (1,610 words) - 18:11, 9 December 2011
• System on a chip
  ...t]] ('''IC''') that integrates all components of a [[computer]] or other [[Electronics|electronic]] [[system]] into a single chip. It may contain [[Digital signal ...chnical direction more than reality: increasing chip integration to reduce manufacturing costs and to enable smaller systems. Many interesting systems are too compl
  9 KB (1,162 words) - 14:47, 10 December 2011
• Integrated circuit design
  ...esign can be divided into the broad categories of [[digital]] and [[analog electronics|analog]] IC design. Digital IC design is to produce components such as [[m ...ocess as of 2006 may well have more than 600 rules. Furthermore, since the manufacturing process itself is not completely predictable, designers must account for it
  14 KB (1,957 words) - 14:47, 10 December 2011
• Design closure
  ...his chip profitably, it must cost $C and run at frequency F." Someone from manufacturing says "To meet this chip’s targets, it must have a yield of Y%." Someone f ...For example, yield is generally an objective, which is maximized to lower manufacturing cost. For the purposes of design closure, the distinction between constrain
  10 KB (1,560 words) - 14:47, 10 December 2011
• Fault coverage
  ...ny engineered system. High fault coverage is particularly valuable during manufacturing test, and techniques such as [[Design For Test]] (DFT) and [[automatic test In [[electronics]] for example, [[stuck-at fault]] coverage is measured by sticking each pin
  3 KB (518 words) - 14:47, 10 December 2011
• Turret board
  ...electronic layout of a set of components. Each hole drilled will have a [[Electronics turret|turret]] positioned in it. Electronic components are suspended betwe ...rporation|Zenith]] 1A10 console radio, circa 1940, consists of an array of electronics components that are simply suspended, rather than tethered or soldered down
  3 KB (448 words) - 14:48, 10 December 2011
• Through-hole technology
  ...ing scheme used for electronic components that involves the use of [[Lead (electronics)|lead]]s on the components that are inserted into holes (PTH - Plated Throu Through-hole technology almost completely replaced earlier electronics assembly techniques such as [[point-to-point construction]].
  4 KB (562 words) - 14:48, 10 December 2011
• Reliability (semiconductor)
  ...before their market introduction e.&nbsp;g. according to the [[Automotive Electronics Council|AEC]] Q100 and Q101 stress qualifications.<ref name="AEC Documents" # Die-attach [[voids]] &ndash; manufacturing defect—screenable with Scanning Acoustic Microscopy.
  6 KB (779 words) - 14:48, 10 December 2011
• Honeywell
  ...l of the [[nuclear bomb]]s in the United States arsenal. Honeywell Federal Manufacturing & Technologies, successor to the defense products of AlliedSignal, operates ...s aggressive implementation and daily practice of [[six sigma]] and [[lean manufacturing]] methodologies commonly referred to as ''Six Sigma Plus''. ''Six Sigma Plu
  28 KB (3,757 words) - 14:49, 10 December 2011
• Step response
  ...multiple poles (or zeros), nonlinearity (signal amplitude dependence) and manufacturing variations, any of which can lead to too much overshoot. The adjustment of [[Category:Electronics terms]]
  21 KB (3,211 words) - 14:49, 10 December 2011

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